A practical selection guide to TE Connectivity board-to-board and mezzanine connectors – pitch, stacking height, mating tolerance, current rating, and layout best practices for compact electronics designs.

Just-in-Time (JIT) has evolved into Just-in-Case. Learn how electronics OEMs optimize inventory with bonded warehouses, buffer agreements, and distributor kitting.

Detailed analysis of connector contact finishes. Understand how micro-vibrations cause fretting corrosion in tin contacts, and when gold flash or selective plating is mandatory.

Compare mechanical reed switches and solid-state Hall effect sensors for proximity detection, door interlocks, and liquid level measurement.

BOM scrubbing prevents costly redesigns before mass production. Learn how distributors analyze lifecycle status, lead times, and multi-sourcing viability.

Protecting 5Gbps to 48Gbps differential pairs without degrading signal integrity. Understand parasitic capacitance requirements (<0.3pF) in TVS array selection.

Crimping quality determines wire-to-board connector life. Learn IPC/WHMA-A-620 crimp inspection criteria, pull-force standards, and how to avoid open-circuit defects.

Examine industrial pressure sensor architectures. Compare piezoresistive strain gauge, capacitive MEMS, and optical pressure sensing for pneumatic and hydraulic monitoring.

Protect sensitive silicon from ESD and lightning surges with TVS diodes. Learn how to calculate standoff voltage, breakdown voltage, and peak pulse power.

Compare PCB terminal blocks: screw terminals vs spring push-in, through-hole vs SMD mounting, and pitch options for power distribution boards.